AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking ...
To demonstrate creep behavior at room temperature, we can use 60/40 solder that contains 60 wt% Sn (tin) and 40 wt% Pb (lead). The phase diagram for the Pb-Sn alloy system is shown below, and the ...
Indium Corporation is proud to announce its participation in the upcoming International Manufacturing Technology ...
The solder alloys with the surface layers of the parts ... solders is considerably less than that of copper, varying with composition between approximately 9 percent and 13 percent for soft ...
The influence of the Ag content on the microstructure and thermal, electrical, and mechanical properties of the bulk solders were investigated. Small additions of Ag resulted in a dramatic change in ...
Low Melting Point,Lower Tensile Strength,Mechanical Properties Of Alloys,Melting Point,Microstructure Of Alloy,Microstructure Of Samples,Moore’s Law,Orthogonal Experiment,Properties Of Alloys,Shear ...
SHENMAO America, Inc. is proud to announce the launch of its special solder paste, PF719-P250A, specifically designed for ...
CLINTON, NY – As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its innovative products and technical presentations at SMTA ...