Semiconductor Packaging News
WEBAnswer: October 3, 1995. October 3, 2024. Cerebras' IPO Paperwork Sheds Light on Relationship with G42. Cerebras, a Silicon Valley AI chip startup, has filed for an IPO, intending to list on Nasdaq under CBRS. The filing reveals 2023 revenues of $79 million, with G42 accounting for 87%.
Semiconductor Packaging News
WEBThe semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
Semiconductor Packaging News Index
WEBSemiconductor Engineering. Oct 4, 2024. SUMMARY. China chip-packaging giant JCET takes over Shanghai plant of US flash memory maker SanDisk. Chinese chip-packaging giant JCET has acquired an 80% stake in SanDisk's Shanghai plant for $624 million, boosting its position in ... South China Morning Post.
Global Semiconductor Sales Increase 20.6% Year-to-Year in August
WEB1 day ago · Global Semiconductor Sales Increase 20.6% Year-to-Year in August. Global semiconductor sales surged to $53.1 billion in August 2024, marking a 20.6% year-over-year increase and 3.5% rise from July. This growth was led by a 43.9% jump in sales to the Americas. The dedicated team at Semiconductor Packaging News has provided this summary for your ...
Semiconductor Packaging News Technical Paper Index
WEBJul 31, 2024. Advanced Packaging for Next-Generation Vehicle. Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ... Amkor Technology, Inc. Jul 24, 2024. The Role of Solder in Advanced Semiconductor Packaging.
TSMC, Amkor to bring advanced chip packaging to U.S. for first time
WEB1 day ago · TSMC and Amkor have partnered to bring advanced chip packaging to the U.S., marking a milestone in American efforts to boost domestic semiconductor capabilities. This collaboration will support key clients like Nvidia, AMD, and Apple, accelerating U.S. chip production and innovation. The dedicated team at Semiconductor Packaging News has ...
CHIPS Subsidy Boosts Advanced Packaging in U.S.
WEBA $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this …
Biden signs bill cutting environmental reviews for semiconductor …
WEB4 days ago · Summary. President Biden signed a bill exempting semiconductor manufacturing facilities from environmental reviews, speeding up key sectors like clean energy. Despite support for boosting innovation, opponents, including environmental groups, warn of potential hazards from toxic waste, particularly PFAS chemicals linked to health risks. The Hill.
TSMC’s Plan For Closing The Communication Gap
WEB4 days ago · TSMC’s Plan For Closing The Communication Gap. TSMC’s North American OIP Ecosystem Forum showcased its innovation roadmap, with N3E in production and N2 planned for 2025. The event emphasized collaboration and tackled the growing compute-memory communication gap, highlighting advances like TSMC's Compact Universal Photonic Engines (COUPE).
Intel Glass Core Substrate Update - Semiconductor Packaging News
WEBIntel Glass Core Substrate Update. INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus on glass core substrates, integral to their Advanced Packaging roadmap unveiled in September 2023.